Herbert Reichl, Prof. Dr.-Ing. Dr.-Ing. E.h.

Portrait of Herbert Reichl

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Head Forschungsschwerpunkt Technologien der Mikroperipherik
Director Fraunhofer Institut Zuverlässigkeit und Mikrointegration
Fachgebiet Mikroelektronik- Aufbau- u. Verbindungstechniken, Institut für Hochfrequenztechnik- und Halbleiter-Systemtechnologien, Fakultät IV – Elektrotechnik und Informatik

Prof. H. Reichl studied Electrical Engineering at the Technical University Munich from 1966 to 1970. He got his Doctor Degrees in 1974. He was a scientific assistant at Fraunhofer Institute IFT and became head of the department "Semiconductor Technologies" and later head of the department "Sensor and Application Techniques". Meanwhile in 1981 he became a professor at the Technical College Munich.

Since 1987 he is professor for Packaging and Interconnection Technologies at the Technical University Berlin and head of the Research Center Microperipherics. Since 1993 he is also head of the Fraunhofer IZM Berlin. In 1996 he further became Head of the Board of Directors of the Fraunhofer Group Microelectronics.

Awards

In 1995 at the International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium (ITAP '95) Prof. Reichl was presented with the Special Award of the Semiconductor Technology Center, USA.

In November 1995 Prof. Reichl received an honorary doctorate from the faculty of Electrical Engineering and Information Technology at the Technical University of Chemnitz.

For his contribution to electronic packaging Professor Herbert Reichl has received the IMAPS Award during the International Symposium on Advanced Packaging Materials in Braselton (USA), in March 2000, by Dr. Phil Garrou, previously President of IMAPS and Director Thin Films, Advanced Electronic Materials, The Dow Chemical Company.

On September 15th, 2000, Professor Herbert Reichl was awarded the Order of Merit of the Federal Republik of Germany (Verdienstkreuz am Bande des Verdienstordens der Bundesrepublik Deutschland). The Order was presented by the State Secretary of the Berlin Senate for Science, Research and Culture, Dr. J. Lange, in recognition of Professor Reichl's outstanding contribution to the advancement of packaging technology in Germany.

In January 2005 the IEEE Components, Packaging and Manufacturing Technology Society awarded Prof. Reichl with a Special Presidential Recognition (in recognition of his lifetime of technical achievement in microelectronics as a scholar, mentor and global leader).

For his eminent contribution to research and development of Fraunhofer-Gesellschaft Professor Herbert Reichl was honoured with the highest award of Fraunhofer-Gesellschaft, the "Fraunhofer Münze" in January 2005.

On October 24, 2006, Prof. Herbert Reichl received the highest award of the VDE, the "Ehrenring des Verbandes der Elektrotechnik, Elektronik und Informationstechnik" for his outstanding achievements in the manufacturing and design of microelectronics and microsystems technologies.

Activities & Memberships

The outstanding position of Prof. Reichl and the recognition among his colleagues in the same field is also reflected in the fact that he is much sought after as a chairman and speaker for international conferences and symposia.

He is the chairman of the Organizing Committee of the SMT/ES&S/Hybrid and of the Micro System Technologies Conference.

He works as a member of program committees and advisory boards of approximately 15 national and international conferences.

Prof. Reichl is senior member and fellow of IEEE, member of IMAPS and also a member of the European High Livel Expert Group of the Nanoelectronics Platform. Additionally he is the Leader of the Domain Teams "Heterogeneous Integration"

Until 2002 he was a board member of the VDE Gsellschaft für Mikroelektronik, Mikrosystem- und Feinwerktechnik, from 1996 thru 2004 head of the board of Directors of the Fraunhofer Alliance Microeletronics, the council of nine Fraunhofer Institutes working in the area of microelectronics.

Publications

Prof. Reichl is the editor of numerous publications. He has written and co-authored 6 books and more than 500 articles. Prof. Reichl holds more than 50 patents, mainly in the field of packaging and interconnection technologies. He is also editor or scientific supervisor of several technical journals.